产品简介
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Semiconductor 检查设备
CIS 检查设备
Color Filter和Micro Lens工程进行时发生的各种污渍性不良（黑线、黑点、白点等），利用光学系统检测出的设备，可以检测出Micro Lens工程中发生的Defocus。
■ 设备规格
| Item | Specification | |||||
| Vision Part | Inspection | Camera | TDI Scan Camera : 12 K | |||
| Pixel Size : 5.2 um | ||||||
| Illuminator | 同轴照明 | |||||
| Dome 照明 | ||||||
| Lens | Micro Lens(X5) | |||||
| Review & Align | Review | WDI ATF | ||||
| Micro Lens(X1, X20, X50) | ||||||
| 同轴照明 | ||||||
| Align | Auto- Align | |||||
| System Part | Net work | TCP/IP | ||||
| RS/232 | ||||||
| Utility | Electrical | 单相 208V ± 10%, 30A, 6.2 KW | ||||
| Pneumatic | 5kg/cm2 Clean Dry Air | |||||
| Chip 选别方式 | Map & Inking | |||||
| Hardware Part | Wafer size | 200mm & 300mm (8" & 12") | ||||
| Wafer Handling | Loading : Auto Loading to Wafer Chuck | |||||
| Unloading : Auto Unloading from Wafer Chuck | ||||||
| XYZ-Stage | X-Axis | Y-Axis | Z-Axis | |||
| Flatness | ±10um | ±10um | ±3um | |||
| Accuracy | ±2um | ±2um | ±5um | |||
| Repeatability | ±1um | ±1um | ±3um | |||
| Wafer Align | Method | Auto- Align | +Vision Type | |||
| Rotation | ±5º | |||||
| Cleanness | HAPA Filter 适用( 0.3 um) | |||||
| Dimension (W x D x H) | 1,780mm x 1,320mm x 2,170mm | |||||
■ 检出不良代表Image